Materials for ICT

This research cluster addresses the future of ICT as we move into an era defined by devices enhanced computing capability to push beyond the boundaries of current state-of-art. Our materials innovations can create computers with better memory and energy efficiency and also improving the very infrastructure of the internet while creating new forms of communication devices such as wearable and flexible electronics.

Our ICT projects are centred on the development of novel materials, processes and devices to enable the 3D vertical integration of logic circuity, memory and other functionality for use in low power computing devices. This research will underpin the development of high performance, low power integrated circuits required by future digital and ICT technologies but also applications in mobile communications technology and the internet of things.

Research within our Materials for ICT theme focuses on providing disruptive advances in science across new devices, magnetic functionality and novel materials for plasmonic systems. The work centres on developing understanding and fabrication strategies to drive the genesis of beyond state-of-the-art devices including the monolithic, integration of devices into backend- of-line circuitry and low power magnetic devices and spintronics.